Display device including a touch sensor and a method of manufacturing the same

ABSTRACT

A display device includes a substrate, a pad electrode, a pixel electrode, an opposite electrode, an encapsulation member, a planarization layer, and a conductive layer. The substrate includes a display region and a peripheral region. The pad electrode is disposed on the substrate in the peripheral region. The pixel electrode and the opposite electrode are disposed on the substrate in the display region. The encapsulation member is disposed on the opposite electrode. The planarization layer is disposed on the encapsulation member in the display region and the peripheral region. The conductive layer is disposed on the planarization layer. The planarization layer includes a contact hole exposing at least a portion of the pad electrode. The conductive layer contacts the portion of the pad electrode exposed through the contact hole.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of co-pending U.S. patent applicationSer. No. 16/898,888, filed on Jun. 11, 2020, which is a Continuation ofU.S. patent application Ser. No. 15/806,853, filed on Nov. 8, 2017, nowU.S. Pat. No. 10,691,237 issued on Jun. 23, 2020, which claims priorityunder 35 U.S.C. § 119 to Korean Patent Application No. 10-2017-0008555,filed on Jan. 18, 2017 in the Korean Intellectual Property Office, thedisclosures of which are incorporated by reference herein in theirentirety.

TECHNICAL FIELD

Exemplary embodiments of the present invention relate to a displaydevice, and more particularly to a display device including a touchsensor and a method of manufacturing the same.

DISCUSSION OF RELATED ART

Display devices such as liquid crystal displays (LCD), organiclight-emitting diode (OLED) displays, and electrophoretic displays mayinclude a field generating electrode and an electro-optical activelayer. For example, an organic light-emitting diode (OLED) displaydevice may include an organic light-emitting layer as theelectro-optical active layer. The field generating electrode may beconnected to a switching element such as a thin film transistor toreceive a data signal. The electro-optical active layer may convert thedata signal into an optical signal to display an image.

When external impurities such as moisture or oxygen penetrate into adisplay device, a life of an electric element included in the displaydevice may be shortened. In an organic light-emitting device, the lightemission efficiency of an emission layer may deteriorate and may becomedeformed.

In order to reduce or prevent impurities such as moisture frompenetrating into the display device, an encapsulation process may beperformed on the electric element included in the display device inorder to separate the electric element from the outside. Theencapsulation process may include a method of laminating a layerincluding an organic polymer such as PET or polyester on a lowersubstrate on which, for example, thin film transistors and an emissionlayer are formed. The encapsulation process may include a method offorming a cover or a cap as an encapsulation substrate and sealing theedges of the lower substrate and the encapsulation substrate using asealant. The encapsulation process may include a method of forming anencapsulation member including the encapsulating thin film layers. Theencapsulating thin film layers may be formed by depositing a pluralityof thin films on the lower substrate, for example, instead of theencapsulation substrate.

In the method of forming the encapsulation member including theplurality of encapsulating thin film layers, the encapsulation membermay be formed by alternately depositing a plurality of organic layersand a plurality of inorganic layers on the lower substrate. Theencapsulating thin film layers may have a relatively high flexibility.Thus, the encapsulating thin film layers may be included in flexibledisplay devices.

In addition to displaying an image, display devices may include a touchsensing function in which interaction with a user may be performed. Thetouch sensing function may detect touch information, such as whether anobject approaches or contacts a screen, and a touch position thereof bysensing changes in, for example, pressure, charge, and light, applied tothe screen by the display device. Changes in, for example, pressure,charge, and light, may be applied to the screen by the display devicewhen the user writes text or draws figures by approaching or contactingan object, for example, a finger or a touch pen on the screen. Thedisplay device may receive an image signal based on the received touchinformation to display an image.

The touch sensing function of the display device may be implementedthrough a touch sensor. The touch sensor may be a resistive type touchsensor, a capacitive type touch sensor, an electro-magnetic (EM) typetouch sensor, or an optical type touch sensor.

The touch sensor may be included in the display device (e.g., an in-celltype), formed on an outer surface of the display device (e.g., anon-cell type), or attached to a separate touch sensor part of thedisplay device (e.g., an add-on cell type). When adhering the touchsensor part on the display device, additional processes formanufacturing the touch sensor part separately from the display paneland adhering the touch sensor part on the display device may be used.Thus, a manufacturing yield of the display device may decrease and amanufacturing cost of the display device may increase. In order to affixthe touch sensor part on the display device, an adhesive layer may bepositioned between the touch sensor part and the display device or onthe touch sensor part. Accordingly, a thickness of the display devicemay increase. The adhered touch sensor part may decrease transmittanceand increase reflectance of the display device. Thus, haze may increasein the display device. On-cell type forming of the touch sensor on theouter surface of the display device may be used, for example, toincrease a transmittance of the display device, and to decreasereflectance and the occurrence of haze.

SUMMARY

Exemplary embodiments of the present invention provide a display devicein which a conductive layer may be formed on an encapsulation memberwithout increasing a dead space or increasing a parasitic capacitance.

Exemplary embodiments of the present invention provide a method ofmanufacturing the display device.

Exemplary embodiments of the present invention provide a display device.The display device includes a substrate, a pad electrode, a pixelelectrode, an opposite electrode, an encapsulation member, aplanarization layer, and a conductive layer. The substrate includes adisplay region and a peripheral region. The pad electrode is disposed onthe substrate in the peripheral region. The pixel electrode and theopposite electrode are disposed on the substrate in the display region.The encapsulation member is disposed on the opposite electrode. Theplanarization layer is disposed on the encapsulation member in thedisplay region and the peripheral region. The planarization layerincludes a contact hole. The contact hole exposes at least a portion ofthe pad electrode. The conductive layer is disposed on the planarizationlayer. The conductive layer contacts the portion of the pad electrodeexposed through the contact hole.

A sidewall of the planarization layer corresponding to the contact holemay have a tapered structure.

A taper angle of the sidewall may be in a range of from about 30 degreesto about 90 degrees.

The planarization layer may include a transparent organic material.

An upper surface of the planarization layer may be flat.

The encapsulation member may include an inorganic layer and an organiclayer. The inorganic layer and the organic layer may be alternatelylayered with each other.

The inorganic layer may at least partially cover the organic layer.

The encapsulation member may include an upper surface and a sidewall.The upper surface may be flat in the display region. The sidewall mayhave a height that decreases in the peripheral region.

The planarization layer may expose the upper surface of theencapsulation layer.

The conductive layer may include a plurality of conductive lines. Theplurality of conductive lines may be disposed in the contact hole andspaced apart from each other.

Exemplary embodiments of the present invention provide a method ofmanufacturing a display device. The method includes preparing asubstrate including a display region and a peripheral region. A padelectrode is disposed on the substrate in the peripheral region. A pixelelectrode and an opposite electrode are disposed on the substrate in thedisplay region. The encapsulation member is disposed on the oppositeelectrode. The planarization layer is disposed on the encapsulationmember in the display region and the peripheral region. The contact holeis disposed in the planarization layer. The contact hole exposes atleast a portion of the pad electrode. The conductive layer is disposedon the planarization layer. The conductive layer contacts the portion ofthe pad electrode exposed through the contact hole.

The disposing of the contact hole may include disposing a mask on theplanarization layer. The mask may include a light blocking portion and alight transmitting portion. The planarization layer may be exposed sothat the light transmitting portion corresponds to the contact hole. Theexposed planarization lay may be etched.

The exposing of the planarization layer may include a defocusing processin which at least one beam of light is focused in a direction oppositeto an exposed surface of the planarization layer.

The defocusing process may further include focusing the at least onebeam of light in a range from about 10 μm to about 15 μm from theexposed surface of the planarization layer.

A sidewall of the planarization layer corresponding to the contact holemay have a tapered structure.

A taper angle of the sidewall may be in a range of from about 30 degreesto about 90 degrees.

The planarization layer may include a transparent organic material.

An upper surface of the planarization layer may be flat.

The method may include patterning the conductive layer to form aplurality of conductive lines. The plurality of conductive lines may bedisposed in the contact hole and may be spaced apart from each other.

The patterning the conductive layer may include forming a photoresistlayer having a uniform thickness on the conductive layer. Thephotoresist layer may be etched to form a plurality of photoresistpatterns corresponding to the plurality of the conductive lines. Theconductive layer may be etched using the plurality of photoresistpatterns as etch-stop patterns.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present disclosure and many of theattendant aspects thereof will be readily obtained as the same becomesbetter understood by reference to the following detailed descriptionwhen considered in connection with the accompanying drawings, wherein:

FIG. 1 is a plan view illustrating a display device according to anexemplary embodiment of the present invention;

FIG. 2 is a cross-sectional view illustrating a display region of adisplay device according to an exemplary embodiment of the presentinvention;

FIG. 3 is a cross-sectional view illustrating a peripheral region of adisplay device according to an exemplary embodiment of the presentinvention;

FIG. 4 is a plan view illustrating a peripheral region of a displaydevice according to an exemplary embodiment of the present invention;

FIGS. 5, 6, 7, and 8 are cross-sectional views illustrating a method ofmanufacturing a display device of FIGS. 2 and 3 according to anexemplary embodiment of the present invention;

FIG. 9 is a cross-sectional view illustrating a peripheral region of adisplay device according to an exemplary embodiment of the presentinvention;

FIGS. 10 and 11 are cross-sectional views illustrating a method ofmanufacturing a display device of FIG. 9 according to an exemplaryembodiment of the present invention;

FIG. 12 is a cross-sectional view illustrating a display region of adisplay device according to an exemplary embodiment of the presentinvention; and

FIG. 13 is a cross-sectional view illustrating a peripheral region of adisplay device according to an exemplary embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Display devices and methods of manufacturing the display devices inaccordance with exemplary embodiments of the present disclosure will bedescribed in detail with reference to the accompanying drawings.

Hereinafter, a display device according to an exemplary embodiment ofthe present invention will be described in more detail below withreference to FIGS. 1, 2, 3, and 4.

FIG. 1 is a plan view illustrating a display device according to anexemplary embodiment of the present invention. FIG. 2 is across-sectional view illustrating a display region of a display deviceaccording to an exemplary embodiment of the present invention. FIG. 3 isa cross-sectional view illustrating a peripheral region of a displaydevice according to an exemplary embodiment of the present invention.FIG. 4 is a plan view illustrating a peripheral region of a displaydevice according to an exemplary embodiment of the present invention.

Referring to FIG. 1, a display device 100 according to an exemplaryembodiment of the present invention may include a substrate 110. Thesubstrate 110 may include a display region 10 and a peripheral region20. The display region 10 may display an image. The peripheral region 20may be positioned outside the display region 10.

A plurality of pixels and a plurality of signal lines may be disposed inthe display region 10. The plurality of signal lines may be connected tothe plurality of pixels, for example, to transmit signals. The pluralityof signal lines may include a plurality of gate lines and a plurality ofdata lines. The plurality of gate lines may transmit gate signals. Theplurality of data lines may transmit data signals. The plurality of gatelines and the plurality of data lines may extend to cross each other.For example, the plurality of gate lines may extend in a first directionand the plurality of data lines may extend in a second directionsubstantially perpendicular to the first direction.

The plurality of pixels may be arranged in a matrix structure; however,an arrangement of the plurality of pixels is not limited thereto. Eachof the pixels may include at least one switching element and a pixelelectrode. The at least one switching element may be connected to eachof the gate line and the data line. The pixel electrode may be connectedto the switching element. For example, the switching element may be athin film transistor (TFT). The switching element may be turned in anON/OFF state, for example, according to the gate signal transmittedthrough the gate line. Thus, the data signal may be selectivelytransmitted through the data line to the pixel electrode.

A pad portion 30 may be disposed in the peripheral region 20. The padportion 30 may be electrically connected to a touch sensor. The touchsensor may be disposed over the substrate 110. A plurality of padelectrodes may be disposed in the pad portion 30.

Referring to FIGS. 1, 2 and 3, the display device 100 may include thesubstrate 110, a pad electrode 120, a pixel electrode 130, an oppositeelectrode 140, an encapsulation member 150, a planarization layer 160,and a conductive layer 170.

The substrate 110 may include glass or plastic. The substrate 110 may beflexible. For example, the substrate 110 may include various plasticssuch as polyethylene terephthalate (PET), polyethylene naphthalate(PEN), polycarbonate (PC), polyarylate (PAR), polyetherimide (PEI),polyether sulfone (PES), polyimide (PI), a metal thin film, and/or athin film glass.

A buffer layer 111 may be disposed on the substrate 110. The bufferlayer 111 may be disposed on the substrate 110 in the display region 10and the peripheral region 20 of the display device 100. The buffer layer111 may reduce or prevent impurities from the outside from passingthrough the substrate 110 and permeating into an upper portion of thedisplay device 100. An upper surface of the buffer layer 111 may besubstantially flat. The buffer layer 111 may include at least oneinorganic layer. For example, the buffer layer 111 may include siliconnitride (SiNx), silicon oxide (SiOx), and/or silicon oxynitride(SiOxNy).

An active pattern 112 may be disposed on the buffer layer 111. Forexample, the active pattern 112 may be disposed on at least a portion ofthe buffer layer 111. The active pattern 112 may be disposed in thedisplay region 10 of the display device 100. The active pattern 112 mayinclude a source region, a drain region, and a channel region. Thesource region and the drain region may be disposed at opposite sides ofthe active pattern 112. The channel region may be disposed between thesource region and the drain region. The active pattern 112 may includean amorphous silicon, a polycrystalline silicon, and/or an oxidesemiconductor.

Referring to FIG. 3, a gate insulation layer 113 may be disposed on thebuffer layer 111. Referring to FIG. 2, the gate insulation layer 113 maybe disposed on the buffer layer 111 and the active pattern 112. The gateinsulation layer 113 may at least partially cover the active pattern112. For example, the gate insulation layer 113 may cover an uppersurface and side surfaces of the active pattern 112. The gate insulationlayer 113 may include multiple layers. The gate insulation layer 113 mayinclude at least one inorganic layer. For example, the gate insulationlayer 113 may include silicon nitride (SiNx), silicon oxide (SiOx),and/or silicon oxynitride (SiOxNy).

A gate conductor may be disposed on the gate insulation layer 113. Thegate conductor may be disposed in the display region 10 of the displaydevice 100. The gate conductor may include a gate line 115 and a gateelectrode 114. The gate line 115 may transmit a gate signal. The gateelectrode 114 may be connected to the gate line 115. The gate electrode114 may overlap at least a portion of the active pattern 112. Forexample, the gate electrode 114 may at least partially overlap thechannel region of the active pattern 112.

An insulation interlayer 116 may be disposed on the gate insulationlayer 113. The insulation interlayer 116 may at least partially coverthe gate conductor. For example, the insulation interlayer 116 may coverside surfaces and an upper surface of each of the gate line 115 and thegate electrode 114 of the gate conductor. The insulation interlayer 116may include multiple layers. The insulation interlayer 116 may includeat least one inorganic layer. For example, the insulation interlayer 116may include silicon nitride (SiNx), silicon oxide (SiOx), and/or siliconoxynitride (SiOxNy). The insulation interlayer 116 and the gateinsulation layer 113 may each include a first contact hole and a secondcontact hole. The first contact hole may expose the source region of theactive pattern 112. The second contact hole may expose the drain regionof the active pattern 112.

According to an exemplary embodiment of the present invention, thebuffer layer 111, the gate insulation layer 113, and the insulationinterlayer 116 may each extend from the display region 10 to theperipheral region 20. For example, the buffer layer 111, the gateinsulation layer 113, and the insulation interlayer 116 may each bedisposed on an entire surface of the substrate 110. Furthermore, thesubstrate 110, the buffer layer 111, the gate insulation layer 113, andthe insulation interlayer 116 may be sequentially stacked.

A data conductor may be disposed on the insulation interlayer 116. Thedata conductor may be disposed in the display region 10 of the displaydevice 100. The data conductor may include a data line 119, a sourceelectrode 117, and a drain electrode 118. The data line 119 may transmita data signal. The data line 119 may cross the gate line 115. The sourceelectrode 117 may be connected to the data line 119. The drain electrode118 may be separated from the data line 119. The source electrode 117and the drain electrode 118 may each be disposed over the active pattern112. The source electrode 117 and the drain electrode 118 may be spacedapart from each other. The source electrode 117 and the drain electrode118 may face each other. The source electrode 117 and the drainelectrode 118 may be connected to the source region and the drain regionof the active pattern 112, for example, through the first and secondcontact holes, respectively. The gate electrode 114 may be disposedbetween the source electrode 117 and the drain electrode 118. The sourceelectrode 117 and the drain electrode 118 may be disposed on each of theinsulation interlayer 116 and the active pattern 112. The sourceelectrode 117 and the drain electrode 118 may each be disposed at leastpartially through the gate insulation layer 113 and through theinsulation interlayer 116.

The thin film transistor may include the active pattern 112, the gateelectrode 114, the source electrode 117, and the drain electrode 118.However, a structure of the thin film transistor is not limited thereto.

Referring to FIG. 3, the pad electrode 120 may be disposed at the padportion 30 in the peripheral region 20 of the display device 100. Thepad electrode 120 may be electrically connected to the conductive layer170 of a touch sensor. The conductive layer 170 may be disposed on theplanarization layer 160. The pad electrode 120 may transmit a drivingsignal to the conductive layer 170. Alternatively, the pad electrode 120may receive a sensing signal from the conductive layer 170.

According to an exemplary embodiment of the present invention, the padelectrode 120 may be disposed on the insulation interlayer 116 asillustrated in FIG. 3. Thus, the data conductor may include the padelectrode 120, the data line 119, the source electrode 117, and thedrain electrode 118. According to an exemplary embodiment of the presentinvention, the pad electrode 120 may be disposed on the gate insulationlayer 113. Thus, the gate conductor may include the pad electrode 120,the gate line 115, and the gate electrode 114.

A passivation layer 121 may be disposed on the insulation interlayer116. The passivation layer 121 may at least partially cover the dataconductor. For example, the passivation layer 121 may cover the dataconductor including the pad electrode 120, the data line 119, the sourceelectrode 117, and the drain electrode 118. The passivation layer 121may have multiple layers. For example, the passivation layer 121 mayinclude at least one of an inorganic layer and an organic layer. Thepassivation layer 121 may include a contact hole. The contact hole mayexpose the drain electrode 118.

The pixel electrode 130 may be disposed on the passivation layer 121.The pixel electrode 130 may be connected to the drain electrode 118, forexample, through the contact hole formed in the passivation layer 121.The pixel electrode 130 may include a transflective conductive material.Alternatively, the pixel electrode 130 may include a reflectiveconductive material.

A pixel defining layer 122 may be disposed on the passivation layer 121.The pixel defining layer 122 may at least partially cover the pixelelectrode 130. For example, the pixel defining layer 122 may cover sidesurfaces and a portion of an upper surface of the pixel electrode 130.The pixel defining layer 122 may include an opening portion. The openingportion may expose at least a portion of the pixel electrode 130. Theopening portion may define a pixel region, for example, from which lightmay be emitted.

According to an exemplary embodiment of the present invention, thepassivation layer 121 and the pixel defining layer 122 may extend fromthe display region 10 to a portion adjacent to a boundary between thedisplay region 10 and the peripheral region 20. In other words, an endof the passivation layer 121 and an end of the pixel defining layer 122may be located at a portion adjacent to a boundary between the displayregion 10 and the peripheral region 20 as illustrated in FIG. 3.According to an exemplary embodiment of the present invention, thepassivation layer 121 and the pixel defining layer 122 may only bedisposed in the display region 10. The passivation layer 121 and thepixel defining layer 122 might not completely cover the pad portion 30in the peripheral region 20. Therefore, the pad electrode 120 may be atleast partially exposed.

A light-emitting member may be disposed on each of the pixel electrode130 and the pixel defining layer 112. The light-emitting member mayinclude a first organic common layer, an organic light-emitting layer135, and a second organic common layer. The first organic common layer,the organic light-emitting layer 135, and the second organic commonlayer may be sequentially layered.

For example, the first organic common layer may include at least one ofa hole injection layer (HIL) and a hole transport layer (HTL). The holeinjection layer (HIL) and the hole transport layer (HTL) may besequentially layered. The first organic common layer may be disposed onan entirety of the display region 10. Alternatively, the first organiccommon layer may be disposed in each pixel region.

The organic light-emitting layer 135 may be disposed on the pixelelectrode 130 of the pixel. The organic light-emitting layer 135 may bedisposed on the pixel electrode 130 and the pixel defining layer 122.The organic light-emitting layer 135 may include an organic material.The organic material may emit red light, green light, or blue light. Theorganic light-emitting layer 135 may include multiple layers. Theorganic light-emitting layer 135 may include a plurality of organicmaterial layers. The plurality of organic material layers may emit lighthaving different colors from each other.

For example, the second organic common layer may include at least one ofan electron transport layer (ETL) or an electron injection layer (EIL).The electron transport layer (ETL) and the electron injection layer(EIL) may be sequentially layered. The second organic common layer maybe disposed on an entirety of the display region 10. Alternatively, thesecond organic common layer may be disposed in each pixel region.

The first and second organic common layers may increase light emissionefficiency of the organic light-emitting layer 135. In some exemplaryembodiments of the present invention, the first organic common layer orthe second organic common layer may be omitted. For example, thelight-emitting member may include the first organic common layer and theorganic light-emitting layer 135. Alternatively, the light-emittingmember may include the second organic common layer and the organiclight-emitting layer 135.

The opposite electrode 140 may be disposed on the light-emitting member.For example, the opposite electrode 140 may be disposed on the organiclight-emitting layer 135. The opposite electrode 140 may transmit acommon voltage. The opposite electrode 140 may include a transparentconductive material. For example, the opposite electrode 140 may includea layer including a transparent conductive material or a relatively slimmetal layer. The relatively slim metal layer may include calcium (Ca),barium (Ba), magnesium (Mg), aluminum (Al), and/or silver (Ag).

A light emitting-element may include the pixel electrode 130 of eachpixel, the light-emitting member, and the opposite electrode 140. Thepixel electrode 130 or the opposite electrode 140 may serve as an anode,and the other of the pixel electrode 130 or the opposite electrode 140may serve as a cathode. For example, the pixel electrode 130 may serveas an anode and the opposite electrode 140 may serve as a cathode.Alternatively, the opposite electrode 140 may serve as an anode and thepixel electrode 130 may serve as a cathode.

According to an exemplary embodiment of the present invention, thedisplay device 100 may be a top-emission type display device. Thus, thedisplay device 100 may emit internal light upwardly from thelight-emitting element and may accordingly display an image.

The encapsulation member 150 may be disposed on the opposite electrode140. The encapsulation member 150 may encapsulate at least a portion ofthe light-emitting member and at least a portion of the oppositeelectrode 140. For example, the encapsulation member 150 may completelyencapsulate the light-emitting member and the opposite electrode 140.Thus, moisture and/or oxygen from the outside may be reduced orprevented from passing through the display device 100.

The encapsulation member 150 may include a plurality of encapsulationlayers. The encapsulation member 150 may include at least one inorganiclayer 151 and at least one organic layer 152. The inorganic layer 151and the organic layer 152 may be alternately layered. The inorganiclayer 151 may include inorganic material such as aluminum oxide (AlOx),silicon oxide (SiOx), and/or silicon nitride (SiNx). The organic layer152 may include organic material. The organic layer 152 may besubstantially flat.

Referring to FIGS. 2 and 3, the encapsulation member 150 may include afirst inorganic layer 151 a, a first organic layer 152 a, a secondinorganic layer 151 b, a second organic layer 152b, and a thirdinorganic layer 151 c. The first inorganic layer 151 a, the firstorganic layer 152 a, the second inorganic layer 151 b, the secondorganic layer 152 b, and the third inorganic layer 151 c may besequentially layered. However, elements and structures of theencapsulation member 150 are not limited thereto. A lowermostencapsulation layer of the plurality of the encapsulation layers may bethe inorganic layer 151 or the organic layer 152. An uppermostencapsulation layer of the plurality of the encapsulation layers may bethe inorganic layer 151 or the organic layer 152. When the uppermostencapsulation layer is the inorganic layer 151, moisture may be reducedor prevented from penetrating the encapsulation member 150. Theinorganic layer 151 of the encapsulation member 150 may at leastpartially cover the organic layer 152 of the encapsulation member 150disposed therebelow. For example, the inorganic layer 151 of theencapsulation member 150 may entirely cover the organic layer 152 of theencapsulation member 150 disposed therebelow. Thus, the organic layer152 of the encapsulation member 150 may be covered by the inorganiclayer 151 of the encapsulation member 150, and the organic layer 152might not be exposed to the outside. Therefore, penetration moisturefrom the outside through the organic layer 152 of the encapsulationmember 150 may be reduced or prevented.

The encapsulation member 150 may at least partially cover the displayregion 10 of the display device 100. For example, the encapsulationmember 150 may entirely cover the display region 10 of the displaydevice 100. Alternatively, the encapsulation member 150 may cover aportion of the peripheral region 20 of the display device 100. Theencapsulation member 150 might not cover the pad portion 30 in theperipheral region 20 of the display device 100. Therefore, the padelectrode 120 may be at least partially exposed. An upper surface 153 ofthe encapsulation member 150 may be substantially flat. Referring toFIG. 2, the upper surface 153 of the encapsulation member 150 may besubstantially flat in the entire display region 10.

Referring to FIG. 3, the encapsulation member 150 may include a sidewall154. A height of the sidewall 154 may gradually decrease in theperipheral region 20. A thickness of the encapsulation member 150 maydecrease toward an edge of the display device 100. Thus, the height ofthe sidewall 154 may gradually decrease. Referring to FIG. 3, sidewall154 of the encapsulation member 150 may be positioned only in theperipheral region 20. Alternatively, the sidewall 154 of theencapsulation member 150 may be positioned in the display region 10 andthe peripheral region 20 of the display device 100. Thus, the height ofthe encapsulation member 150 may decrease in a direction from a locationin the peripheral region 20 toward an edge of the display device 100.Alternatively, the height of the encapsulation member 150 may decreasefrom an edge portion of the display region 10 adjacent to the boundarybetween the peripheral region 20 and the display region 10 toward anedge of the display device 100.

The planarization layer 160 may be disposed on the encapsulation member150 in the display region 10 and the peripheral region 20. Theplanarization layer 160 may cover at least a portion of theencapsulation member 150. Referring to FIG. 1, planarization layer 160may cover an entire surface of the encapsulation member 150.Alternatively, the planarization layer 160 may cover a portion of theencapsulation member 150. The planarization layer 160 may include atleast a portion covering the sidewall 154 of the encapsulation member150.

The planarization layer 160 may include transparent organic material.The planarization layer 160 may include a material substantially thesame as or different from the organic material included in the organiclayer 152. The organic material included in the planarization layer 160may have substantially the same or different viscosity as the organicmaterial included in the organic layer 152 of the encapsulation member150. If the planarization layer 160 includes the transparent organicmaterial, an efficiency of light emitted from the organic light-emittinglayer 135 might not be reduced.

According to an exemplary embodiment of the present invention, theplanarization layer 160 including the organic material may include aportion exposed to the outside. Penetration of moisture may occurthrough the exposed portion of the planarization layer 160. However, theencapsulation member 150 may be disposed below the planarization layer160. Thus, reliability failure of the display device 100, for example,due to moisture penetration may be reduced or prevented. A substantialportion of the organic layer 152 included in the encapsulation member150 may be covered by the inorganic layer 151. Thus, although moisturepenetration may occur through the planarization layer 160, the moisturepenetration might not reach the light-emitting element in the displayregion 10 of the display device 100.

Referring to FIG. 4, the planarization layer 160 may include a contacthole 162. The contact hole 162 may expose the pad electrode 120, Forexample, the planarization layer 160 may cover an edge portion of thepad electrode 120, and may expose a center portion of the pad electrode120 through the contact hole 162. Thus, the planarization layer 160 mayinclude a sidewall 164. The sidewall 164 may correspond to the contacthole 162.

The conductive layer 170 may be disposed on the planarization layer 160.For example, the conductive layer 170 may be a touch sensing layerincluded in a touch sensor that may sense a touch event. The touch eventmay include a case in which an external object approaches a touchsurface of the display device or hovers in an approached state. Thetouch event may also include a case in which an external object such asa finger or the user directly contacts the touch surface of the displaydevice. The touch sensor directly formed on an upper surface of thedisplay device may be referred as an on-cell type touch sensor.

The conductive layer 170 may be formed along an upper surface 166 andthe sidewall 164 of the planarization layer 160. The conductive layer170 may be disposed on a portion of the pad electrode 120 exposed by thecontact hole 162. Thus, the pad electrode 120 and the conductive layer170 may be in contact with each other. The pad electrode 120 and theconductive layer 170 may also be electrically connected to each other.

According to an exemplary embodiment of the present invention, thesidewall 164 of the planarization layer 160 may have a taperedstructure. If the sidewall 164 of the planarization layer 160 has areverse-tapered structure, the conductive layer 170 might not bedisposed on the sidewall 164 of the planarization layer 160. Thus, theconductive layer 170 disposed on the pad electrode 120 may be separatedfrom the conductive layer 170 disposed on the upper surface 166 of theplanarization layer 160. Accordingly, the touch sensor might notoperate.

According to an exemplary embodiment of the present invention, a taperangle ⊖ of the sidewall 164 of the planarization layer 160 may be in arange of from about 30 degrees to about 90 degrees. When the taper angle⊖ is less than about 30 degrees, an area of the upper surface 166 of theplanarization layer 160 may decrease, for example, due to an area of thesidewall 164 of the planarization layer 160 increasing. When the taperangle ⊖ is greater than about 90 degrees, the touch sensor might notoperate, for example, due to the sidewall 164 of the planarization layer160 having a reverse-tapered structure as described above.

According to an exemplary embodiment of the present invention, asdescribed above, the planarization layer 160 may cover the entiresurface of the encapsulation member 150. The area of the substantiallyflat upper surface 166 of the planarization layer 160 may be increased.Therefore, an area for forming the conductive layer 170 on theplanarization layer 160 may be increased.

If the planarization layer 160 is not formed, the conductive layer 170may be formed only on the upper surface 153 of the encapsulation member150 in a first comparative example. Alternatively, the conductive layer170 may be formed on the sidewall 154 of the encapsulation member 150corresponding to the profile of the sidewall 154 of the encapsulationmember 150 in a second comparative example. In the first comparativeexample, a region for forming the conductive layer 170 may be limited.Thus, a dead space in which a touch is not sensed in the display device100 may increase. In the second comparative example, a failure may occuron the conductive layer 170 according to the profile of the sidewall 154of the encapsulation member 150, which has an uneven surface due toinsulation layers and conductive layers therebelow. Thus, the touchsensor may not operate correctly.

However, the display device 100 according to an exemplary embodiment ofthe present invention may include the planarization layer 160. Thus, anarea of the flat upper surface 166 of the planarization layer 160 may beincreased. Additionally, the upper surface 166 of the planarizationlayer 160 may be flattened in a substantial portion of the peripheralregion 20. Accordingly, a region in which the conductive layer 170 ofthe touch sensor is formed may operate correctly, and a dead space inwhich a touch is not sensed in the display device 100 may be reduced.

Parasitic capacitance may be generated between the opposite electrode140 and the conductive layer 170 of the touch sensor. If parasiticcapacitance increases, the characteristic of the touch sensor may beinfluenced. When the conductive layer 170 of the touch sensor isdirectly formed on the encapsulation member 150 without theplanarization layer 160, the conductive layer 170 of the touch sensorformed on the sidewall 154 of the encapsulation member 150 may increasethe parasitic capacitance between the opposite electrode 140 and theconductive layer 170 of the touch sensor. Thus, the conductive layer 170of the touch sensor may be formed only on the flat upper surface 153 ofthe encapsulation member 150, and a dead space in which a touch is notsensed in the display device 100 may further increase.

However, the display device 100 according to an exemplary embodiment ofthe present invention may include the planarization layer 160. Thus,parasitic capacitance may be reduced between the opposite electrode 140and the conductive layer 170. Accordingly, a touch sensitivity of thetouch sensor may increase, and a dead space of the display device 100may be reduced.

A method of manufacturing a display device according to an exemplaryembodiment of the present invention will be discussed in more detailbelow with reference to FIGS. 2, 3, 5, 6, 7, and 8.

FIGS. 5, 6, 7, and 8 are cross-sectional views illustrating a method ofmanufacturing a display device of FIGS. 2 and 3 according to anexemplary embodiment of the present invention.

Referring to FIGS. 5 and 6, the planarization layer 160 may be formed onthe substrate 110 on which the encapsulation member 150 is formed. Thus,the encapsulation member 150 and the planarization layer 160 may besequentially layered on the substrate 110 of the display device 100. Theplanarization layer 160 may be formed in the display region 10 and theperipheral region 20 of the display device 100. For example, theplanarization layer 160 may be formed on substantially the entiresurface of the substrate 110. The planarization layer 160 may cover theencapsulation member 150 and the pad electrode 120 of FIG. 3.

According to an exemplary embodiment of the present invention, theplanarization layer 160 may include a transparent organic material. Thetransparent organic material may be disposed on the encapsulation member150. Thus, the transparent organic material may form the planarizationlayer 160. The planarization layer 160 may have a substantially flatupper surface 166 through the display region 10 and the peripheralregion 20 of the display device 100.

Referring to FIG. 7, a mask 180 may be positioned over the planarizationlayer 160. Accordingly, an exposure process may be performed. Due to themask 180, the exposure process may be performed with different doses andat different times between a region on which the contact hole 162 is tobe formed and a region on which the contact hole 162 is not to beformed.

The mask 180 may be prepared. The mask 180 may include a light blockingportion 182 and a light transmitting portion 184. The light blockingportion 182 may block substantially all light (e.g., may have a lighttransmittance of about 0%). The light transmitting portion 184 maytransmit substantially all light (e.g., may have a light transmittanceof about 100%). The exposure process may be performed by positioning themask 180 such that the light blocking portion 182 corresponds to theregion on which the contact hole 162 is not to be formed, and the lighttransmitting portion 184 corresponds to the region on which the contacthole 162 is to be formed.

According to an exemplary embodiment of the present invention,defocusing may be performed during the exposure process. Defocusing maycause a beam of light to be focused away from an exposed surface of theplanarization layer 160. Thus, if defocusing is performed such that abeam of light is focused about 10 μm to about 15 μm from the exposedsurface, the sharpness of borders of the regions exposed through thelight transmitting portion 184 of the mask 180 may be reduced.

Accordingly, since the sidewall 164 of the planarization layer 160formed by the etching process after the exposure process is graduallyinclined, the sidewall 164 of the planarization layer 160 may have atapered structure. Accordingly, if the taper angle ⊖ is less than about90 degrees, the conductive layer 170 might not be disconnected. Thus, afailure of the touch sensor may be reduced or prevented. The conductivelayer 170 may be formed on the planarization layer 160. If the taperangle O is relatively small, however, then the area of the sidewall 164of the planarization layer 160 may increase. As the area of the sidewall164 of the planarization layer 160 increases, the area of the uppersurface 166 of the planarization layer 160 may decrease. Accordingly,the taper angle ⊖ may be greater than about 30 degrees.

Referring to FIG. 8, the exposed planarization layer 160 may be etchedto form the contact hole 162.

The region on which light is substantially blocked by the light blockingportion 182 may remain as the planarization layer 160. The region onwhich light is substantially transmitted by the light transmittingportion 184 may be removed by the etching process. Accordingly, thecontact hole 162 may be formed. The pad electrode 120 may be exposedthrough the contact hole 162.

Referring to FIGS. 2 and 3, the conductive layer 170 may be formed onthe planarization layer 160. The conductive layer 170 may cover theupper surface 166 and the sidewall 164 of the planarization layer 160.The conductive layer 170 may be formed in the contact hole 162 of theplanarization layer 160. Thus, the conductive layer 170 may be contactthe pad electrode 120 through the contact hole 162. Accordingly, the padelectrode 120 and the conductive layer 170 may be electrically connectedto each other.

Hereinafter, a display device according to an exemplary embodiment ofthe present invention will be described in more detail with reference toFIG. 9.

FIG. 9 is a cross-sectional view illustrating a peripheral region of adisplay device according to an exemplary embodiment of the presentinvention.

Referring to FIG. 9, the display device 100 according to an exemplaryembodiment of the present invention may include the substrate 110, thepad electrode 120, the opposite electrode 140, the encapsulation member150, the planarization layer 160, and the conductive layer 170. Thedisplay device 100 according to an exemplary embodiment of the presentinvention may also include the pixel electrode 130 as illustrated inFIG. 2.

The display device 100 illustrated in FIG. 9 may have elements and/orstructures substantially the same as or similar to those of the displaydevice 100 illustrated in FIGS. 2 and 3. Accordingly, detaileddescriptions of similar elements and/or structures may be omitted.

The conductive layer 170 may be disposed on the planarization layer 160.For example, the conductive layer 170 may be a touch sensing layer. Thetouch sensing layer may be included in a touch sensor. The touch sensormay sense a touch event from the outside. The touch event may include anexternal object approaching a touch surface of the display device orhovering over the touch surface of the display device in an approachedstate. The touch event may also include an external object such as afinger or the user directly contacts the touch surface of the displaydevice. As such, the touch sensor directly formed on an upper surface ofthe display device may be referred as an on-cell type touch sensor.

The conductive layer 170 may be formed along the upper surface 166 andthe sidewall 164 of the planarization layer 160. The conductive layer170 may be disposed on a portion of the pad electrode 120 exposed by thecontact hole 162. Therefore, the pad electrode 120 and the conductivelayer 170 may be in contact with each other. The pad electrode 120 andthe conductive layer 170 may be electrically connected to each other.

The conductive layer 170 may include a plurality of conductive lines175. The plurality of conductive lines 175 may be disposed in thecontact hole 162. The plurality of conductive lines 175 may be spacedapart from each other. For example, the conductive lines 175 may betouch sensing electrodes or touch sensing lines of the touch sensor.

Hereinafter, a method of manufacturing a display device according to anexemplary embodiment of the present invention will be described in moredetail below with reference to FIGS. 3, 9, 10, and 11.

FIGS. 10 and 11 are cross-sectional views illustrating a method ofmanufacturing a display device of FIG. 9 according to an exemplaryembodiment of the present invention.

Referring to FIG. 3, the conductive layer 170 may be formed on theplanarization layer 160. The conductive layer 170 may cover the uppersurface 166 and the sidewall 164 of the planarization layer 160. Theconductive layer 170 may be formed in the contact hole 162 of theplanarization layer 160. Thus, the conductive layer 170 may be incontact with the pad electrode 120 through the contact hole 162.Accordingly, the pad electrode 120 and the conductive layer 170 may beelectrically connected to each other.

Referring to FIGS. 10 and 11, a photoresist layer 190 may be formed onthe conductive layer 170. Photosensitive material may be applied on theconductive layer 170, for example, to form the photoresist layer 190.The photoresist layer 190 may have a substantially uniform thickness.

If a slope of the sidewall 164 of the planarization layer 160 isrelatively steep, the photosensitive material may be cornered at an edgeof the contact hole 162. Thus, a thickness of the photoresist layer 190formed on the edge of the contact hole 162 may be relatively thick.Accordingly, the photoresist patterns 192 might not be formed due to theuneven thickness of the photoresist layer 190. However, in a method ofmanufacturing the display device 100 according to an exemplaryembodiment of the present invention, the slope of the sidewall 164 ofthe planarization layer 160 may be relatively small. Thus, thephotoresist layer 190 may have a substantially uniform thickness.Accordingly, the photoresist patterns 192 may be formed.

Referring to FIG. 11, the photoresist layer 190 may be etched to formthe plurality of photoresist patterns 192. The plurality of photoresistpatterns 192 may correspond to the plurality of conductive lines 175.For example, the photoresist layer 190 may be exposed and developed byusing a mask to form the plurality of photoresist patterns 192.

Referring to FIG. 9, the conductive layer 170 may be etched by using theplurality of photoresist patterns 192 as etch-stop patterns.Accordingly, the plurality of conductive lines 175 may be formed. Theremaining photoresist patterns 192 may be removed, for example, by anashing method.

Hereinafter, a display device according to an exemplary embodiment ofthe present invention will be described in more detail below withreference to FIGS. 12 and 13.

FIG. 12 is a cross-sectional view illustrating a display region of adisplay device according to an exemplary embodiment of the presentinvention. FIG. 13 is a cross-sectional view illustrating a peripheralregion of a display device according to an exemplary embodiment of thepresent invention.

Referring to FIGS. 12 and 13, the display device 100 according to anexemplary embodiment of the present invention may include the substrate110, the pad electrode 120, the pixel electrode 130, the oppositeelectrode 140, the encapsulation member 150, the planarization layer160, and the conductive layer 170.

The display device 100 illustrated in FIGS. 12 and 13 may have elementsand/or structures substantially the same as or similar to those of thedisplay device 100 illustrated in FIGS. 2 and 3 except for the structureof the planarization layer 160. Accordingly, detailed descriptions ofthe same elements and/or structures may be omitted.

In the display device 100 according to an exemplary embodiment of thepresent invention, the planarization layer 160 might not be formed on anentire surface of the encapsulation member 150. For example, theplanarization layer 160 may be formed on a portion of the encapsulationmember 150. The planarization layer 160 may expose a portion of theencapsulation member 150. Specifically, the planarization layer 160 maycover the sidewall 154 of the encapsulation member 150 of which heightis gradually decreasing. The planarization layer 160 may expose the flatupper surface 153 of the encapsulation member 150. For example,referring to FIG. 12, the planarization layer 160 might not be disposedin the display region 10. The planarization layer 160 may only bedisposed in the peripheral region 20. The planarization layer 160 mayinclude a portion disposed in the peripheral region 20 and covers thesidewall 154 of the encapsulation member 150 as illustrated in FIG. 13.

According to an exemplary embodiment of the present invention, atransparent organic material may be applied on substantially an entiresurface of the encapsulation member 150 to form a transparent organiclayer. An upper portion of the transparent organic layer may be removedto form the planarization layer 160.

According to an exemplary embodiment of the present invention, theplanarization layer 160 may cover the sidewall 154 of the encapsulationmember 150. The upper surface 153 of the encapsulation layer 150 may besubstantially flat. Accordingly, the conductive layer 170 may also beformed on the planarization layer 160. Thus, a region for forming theconductive layer 170 may be increased and a dead space of the displaydevice 100 may be reduced.

The display device according to exemplary embodiments of the presentdisclosure may be applied to a display device included in, for example,a computer, a notebook, a mobile phone, a smartphone, a smart pad, aportable media player (PMP), a personal digital assistant (PDA), an MP3player, or the like.

Although the display device and the method of manufacturing the displaydevice according to exemplary embodiments of the present disclosure havebeen described with reference to the drawings, the illustratedembodiments are examples, and may be modified and changed by a personhaving ordinary knowledge in the relevant technical field withoutdeparting from the technical spirit of the present disclosure describedin the following claims.

What is claimed is:
 1. A display device, comprising: a substratecomprising a display region and a non-display region; a pixel electrodeand an opposite electrode disposed on the substrate in the displayregion; an encapsulation member disposed on the opposite electrode, theencapsulation member having a lower surface facing the substrate and anupper surface facing away from the substrate; a planarization layerdisposed on the upper surface of the encapsulation member in thenon-display region; and a conductive layer disposed on the planarizationlayer, wherein the planarization layer includes a lower surface facingthe substrate and an upper surface facing away from the substrate andthe conductive layer is disposed on the upper surface of theplanarization layer, wherein an entirety of the upper surface of theencapsulation member is flat in the display region, and theencapsulation member includes a sidewall having a height that decreasesin the non-display region, and wherein the planarization layer is formedon a portion of the encapsulation member in the non-display region.